尊龙凯时人生就是搏z6com

搜索
产品技术
当前位置:
首页
/
/
/
FO Series

封装品种

FO Series

分类: FO Series
FO Series
技术介绍

FO Technology

FO Series

Technology Overview

We offer both Chip First and Chip last solutions. For chip first technology,first step is place die face down on the temporary carrier with adhesion layer. The second step is to cover the die surface by molding compound (EMC). The third step is to remove the adhesion layer and the temporary carrier through thermal release; Finally, RDL layer and solder ball are directly made on die& compound surface.

Fan out can use not only compound materials, but also substrates, thus expanding the fan out package to another type: fan out package on substrate (FOPoS).

Applications

We will optimize our solutions to meet customer requirements. FO technologies are used in MIC, RF, CPU, GPU and network.

Features

 ◆ FO size: 32x26mm

 ◆ Advance nodes to 16 nm

 ◆ RDL L/S: 2/2um

 ◆ RDL layer: 3 layers

Package types

 ◆ eWLB

 ◆ FOPoS-chip first face down

 ◆ FOPoS-chip first face up

 ◆ FOPoS-chip last

Key advantages include

 ◆ Low cost than 2.5D

 ◆ Good electrical performance

 ◆ High I/O pin counts

We also offer extensive test developments for products and are experienced in CPU, APU, GPU, Chipset, Digital Audio, Baseband, Microcontroller, LCD Driver, Touch Panel Driver.

上一个
下一个
通富微

尊龙凯时人生就是搏子股份有限公司

地址:中国江苏省南通市崇川路288号

邮编:226004

Copyright © 2021 尊龙凯时人生就是搏子股份有限公司 版权所有.     苏ICP备58257937号      苏公网安备32060202001174号

Copyright © 2021 尊龙凯时人生就是搏子股份有限公司 版权所有.  苏ICP备58257937号

网站首页
尊龙凯时人生就是搏z6com